Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage - Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
Products specifications
Attribute name | Attribute value |
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Package width | 3.31" |
Package depth | 5.94" |
Package weight | 0.6 oz |
Operating temperature (T-T) | -30 - 180 °C |
Thermal resistance | 0.12 °C/W |
Thermal conductivity | 1.93 W/m·K |
Specific gravity | 1.7 g/cm³ |
Evaporation (@ 200°C/24h) | 0.001 % |
Bleed (@ 200°C/24h) | 0.05 % |